恒坤新材8月29日上交所首发上会 拟募资10.07亿元

Core Points - The Shanghai Stock Exchange's Listing Review Committee is scheduled to hold its 32nd meeting on August 29, 2025, to review the listing application of Xiamen Hengkang New Materials Technology Co., Ltd. (referred to as "Hengkang New Materials") [1] - Hengkang New Materials plans to raise funds amounting to 1,006.695 million yuan, which will be allocated to the second phase of the integrated circuit precursor project and the advanced materials project for integrated circuits [1] - The sponsor (lead underwriter) for Hengkang New Materials is CITIC Securities Co., Ltd., with representatives Wu Jianhang and Liu Shaoqian [1]