Core Insights - The company reported a revenue of 284.04 million yuan for the first half of 2025, representing a year-on-year growth of 23.09% [2][3] - The net profit attributable to shareholders was a loss of 7.06 million yuan, showing a narrowing of losses compared to the previous year [2][3] - The net profit after deducting non-recurring gains and losses was a loss of 6.76 million yuan [2][3] Financial Performance - Total revenue for the reporting period was 284.04 million yuan, up from 230.75 million yuan in the same period last year, marking a 23.09% increase [3] - The total profit for the period was a loss of 8.95 million yuan, an improvement from a loss of 16.37 million yuan year-on-year [3] - The net cash flow from operating activities was 100.79 million yuan, down 9.40% from 111.24 million yuan in the previous year [3] Segment Performance - Revenue from integrated circuit testing reached 277.29 million yuan, a 21.85% increase year-on-year, with the second quarter achieving a record high of 150.26 million yuan [2][3] - The growth in testing revenue was driven by sustained demand from existing customers and new product introductions [2][3] - Revenue from wafer thinning and related services was 674.54 thousand yuan, up 111.61% year-on-year, attributed to the company's strategic layout and capacity release [4] Strategic Developments - The company is implementing a "one body, two wings" strategy, focusing on wafer thinning and laser grooving as extensions of its integrated circuit testing services [4] - A partnership with Dieling Optoelectronics has been established to provide unique services in wafer hetero-layering and testing [4] - The technology developed by Dieling Optoelectronics aims to enhance imaging capabilities under various weather conditions, supporting advancements in autonomous driving and robotics [4]
利扬芯片H1实现营收2.84亿元,亏损同比有所收窄