Core Viewpoint - Pan-Asia Microelectronics (688386.SH) plans to raise a total of no more than 698.51 million yuan through a private placement of shares, with the net proceeds intended for various projects including smart manufacturing upgrades, 6G communication materials, R&D center construction, and working capital [1] Group 1 - The total amount to be raised is capped at 698.51 million yuan [1] - The net proceeds after deducting issuance costs will be allocated to specific projects [1] - The projects include CMD product smart manufacturing upgrades and the industrialization of low dielectric loss FCCL flexible copper-clad laminates for 6G communications [1] Group 2 - Additional funding will be directed towards the construction of a research and development center [1] - A portion of the funds will also be used to supplement working capital [1]
泛亚微透(688386.SH):拟定增募资不超过6.99亿元