Group 1 - The core viewpoint is that the company, as a leading player in the domestic design sector, has significant long-term growth potential and a favorable competitive landscape, particularly benefiting from the trend of AI edge computing [1] - The company's target market for niche storage and MCU core products is expected to exceed $50 billion by 2029, with projected global market shares for NoR Flash, niche DRAM, SLC NAND, and MCU in 2024 being 18.5%, 1.7%, 2.2%, and 1.2% respectively, indicating ample growth space [1] - The competitive landscape is expected to be dominated by South Asia, Winbond, and domestic leading enterprises, with South Asia and Winbond's niche storage manufacturers experiencing continuous losses and historically low gross margins in Q1 2025, while international giants are gradually exiting the niche DRAM market, suggesting a sustained price increase trend until the end of the year [1] Group 2 - The 3D WoW solution demonstrates customization and high-performance advantages in edge AI, with ASIC chips being recognized for their high bandwidth and low latency, leading to a trend of self-developed ASICs for AI inference [2] - Memory bandwidth is identified as a bottleneck in edge AI systems, and the company's customized storage is making progress in various fields such as AI smartphones, AI PCs, automotive, and robotics, which is expected to become a significant contributor to the company's DRAM business line [2] - Revenue forecasts for the company are projected to be approximately 9.13 billion, 11.11 billion, and 13.53 billion yuan for 2025 to 2027, with net profits expected to be around 1.67 billion, 2.02 billion, and 2.62 billion yuan respectively, highlighting the company's leading position in the customized storage sector [2]
兆易创新(603986):端侧AI存储龙头 空间足&格局优