泛亚微透:拟定增募资不超过6.99亿元 用于6G通讯的低介电损耗FCCL挠性覆铜板产业化项目等
Group 1 - The company, Pan-Asia Microelectronics (688386.SH), announced a plan to raise no more than 699 million yuan through a private placement [1] - The net proceeds from the fundraising, after deducting issuance costs, will be allocated to several projects including the CMD product intelligent manufacturing upgrade and expansion project, the industrialization project of low dielectric loss FCCL flexible copper-clad laminates for 6G communications, the construction of a research and development center, and to supplement working capital [1]