20cm速递 | 科创芯片ETF国泰（589100）盘中涨近3%，行业趋势与国产替代双轮驱动

Core Viewpoint - The advanced packaging technology is becoming a critical path to support the computing power demands of AI and high-performance computing, as traditional processes struggle to overcome the "power wall, memory wall, and cost wall" bottlenecks [1] Group 1: Industry Insights - The HBM+CoWoS combination has become a standard requirement for AI servers due to their extreme demands for high bandwidth storage and high-speed interconnects [1] - The complexity of automotive SoCs is increasing due to the push for smart vehicles, alongside a recovery in the consumer electronics cycle, contributing to sustained market growth [1] - Domestic manufacturers are accelerating their technological catch-up in wafer-level packaging and 2.5D/3D processes, benefiting from a window of opportunity created by policy and capital collaboration [1] Group 2: ETF and Index Information - The Guotai Sci-Tech Chip ETF (589100) rose nearly 3% in early trading on August 27, tracking the Sci-Tech Chip Index (000685), which reflects the overall performance of listed companies in the chip industry [1] - The Sci-Tech Chip Index includes 50 constituent stocks focused on core chip areas and has a daily price fluctuation limit of 20%, indicating high market elasticity [1] - Investors without stock accounts can consider the Guotai SSE Sci-Tech Chip ETF Initiation Link A (024853) and Link C (024854) [1]