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芯和半导体:系统攻坚大势所趋 Chiplet生态系统走向“拼多多模式”
Zheng Quan Shi Bao Wang·2025-08-27 10:20

Core Insights - The ninth China System-Level Packaging Conference highlighted the shift in the Chiplet ecosystem from a closed model to an open standard model, emphasizing collaboration across the industry [1][3] - AI is recognized as a core driver of the fourth industrial revolution, creating significant demand for semiconductor performance in various applications [1] - The integration of Chiplet technology with AI super-node hardware systems is seen as a crucial direction for overcoming limitations in advanced manufacturing processes and enhancing computing power [2] Industry Trends - Chiplet systemization and heterogeneous integration are becoming essential for sustaining computing power growth, widely adopted by major AI chip companies like NVIDIA, AMD, and Broadcom [2] - The release of UCIe 3.0 and the maturation of various Chiplet standards are facilitating a transition towards a more open and collaborative Chiplet ecosystem in China [3] - The complexity of Chiplet integration systems necessitates a shift from traditional design optimization to a more comprehensive system-level optimization approach [2] Company Strategies - The company, Chip and Semiconductor, is focusing on "STCO integrated system design" and developing multi-physics engine technologies to support advanced Chiplet packaging [3] - The company aims to provide a full-stack integrated system EDA solution, enhancing the design of next-generation high-speed and high-frequency smart electronic products across various sectors [3] - There is a call for collaboration among all segments of the domestic Chiplet advanced packaging industry to leverage AI opportunities and strengthen capabilities across materials, processes, design, and EDA tools [3]