龙蟠科技沪港两市融资超30亿负债率增速仍远超同行 产能利用率不足拟定增再募20亿

Core Viewpoint - Longpan Technology announced a plan to raise 2 billion yuan through a private placement to fund high-performance phosphate cathode material projects and supplement working capital, despite facing rapid increases in debt levels compared to peers [1][2][8]. Financing Activities - Longpan Technology has raised over 3 billion yuan through various financing methods since its A-share listing in 2017, including convertible bonds, private placements, and Hong Kong IPOs [7]. - The company plans to raise 2.06 million shares, totaling 2 billion yuan, for projects involving 11,000 tons and 8,500 tons of high-performance phosphate cathode materials [2][8]. - Previous financing activities include 400 million yuan from convertible bonds in April 2020 and 2.2 billion yuan from a private placement in June 2022 [3][4]. Debt Levels - Longpan Technology's debt ratio has increased significantly, reaching 78.41% by June 2025, with interest-bearing liabilities totaling 11.6 billion yuan, a 50-fold increase from 245 million yuan at the end of 2017 [10]. - The company's debt growth rate is notably faster than that of comparable companies such as Hunan Youneng and Defang Nano [8]. Capital Expenditure and Utilization - The company has consistently engaged in large capital expenditures, yet its overall capacity utilization remains below 80%, with additional capacity under construction [14]. - Longpan Technology's research and development expenditure has been increasing, significantly outpacing that of comparable companies, but this has not translated into improved profitability [12][15]. Market Performance - Despite the ongoing financing and investment efforts, Longpan Technology's stock price has halved compared to the price during its previous private placement in 2021, raising concerns about the effectiveness of its financing and investment strategies [15].