KingShine(SZ:300903) Ge Long Hui A P P·2025-08-28 07:56Core Viewpoint - The company has made significant advancements in high-density interconnect (HDI) technology, indicating a strong commitment to research and development in this area [1] Technology Development - The company has mastered 16-layer arbitrary layer interconnection technology and 30-45μm ultra-thin PP lamination technology [1] - Achievements include laser blind hole diameter of 75±10μm, X-hole size of 75-100μm, and line width/spacing of 50/50μm [1] - The blind hole plating aspect ratio is 0.8:1, with a blind hole alignment accuracy of 50μm [1] Future Plans - The company plans to continue increasing R&D investment in HDI products to enhance manufacturing capabilities [1] - The goal is to align with the latest technological developments and meet the demand for PCB products [1]