全球首款全频段高速通信芯片问世

Core Insights - A groundbreaking adaptive, broadband, high-speed wireless communication chip has been developed using advanced thin-film lithium niobate photonic materials, marking a significant achievement in optoelectronic integration technology [1][2] - The chip overcomes the limitations of traditional electronic hardware, which operates only in single frequency bands, by enabling cross-band functionality [1] - The system achieves a transmission rate exceeding 120 gigabits per second, meeting the peak rate requirements for 6G communication [2] Group 1 - The chip integrates capabilities for broadband wireless and optical signal conversion, low-noise carrier signal coordination, and digital baseband modulation, effectively bridging the gap between different frequency devices [1] - The proposed integrated optoelectronic oscillator (OEO) architecture utilizes high-precision optical micro-ring frequency locking, enabling rapid and precise generation of communication signals across a super-wide frequency range from 0.5 GHz to 115 GHz [1] - This innovation addresses previous challenges in balancing bandwidth, noise performance, and reconfigurability, representing a milestone breakthrough in the field [1] Group 2 - The chip is expected to lay the hardware foundation for "AI-native networks," allowing dynamic adjustment of communication parameters to adapt to complex electromagnetic environments [2] - Future applications include enhancing base stations and vehicular devices to accurately sense their surroundings during data transmission, driving upgrades in key components such as broadband antennas and optoelectronic integrated modules [2] - The development paves the way for efficient utilization of frequency spectrum resources in terahertz and higher frequency bands for 6G communication [2]