国内首台先进封装用晶圆修边设备在汉交付

Group 1 - Wuhan Xinfeng Precision Technology Co., Ltd. has developed China's first fully automatic wafer trimming equipment for advanced packaging, named UNI-D310T, which has been successfully delivered to a domestic semiconductor manufacturer [1][2] - The UNI-D310T equipment integrates two key processes: wafer trimming and dicing, and is compatible with both 8-inch and 12-inch wafers, supporting various cutting modes [2][3] - The successful application of this equipment reduces the long-standing reliance on imported trimming equipment in the domestic advanced packaging sector, providing a viable option for cost reduction and equipment localization in the testing and packaging industry [2][3] Group 2 - The development of the UNI-D310T involved a dedicated R&D team that worked intensively to solve algorithm parameter deviations during the testing phase, demonstrating the technical challenges faced in achieving high precision [3] - The production schedule for Xinfeng Precision's equipment is fully booked until June of the following year, indicating strong market demand [3] - The company plans to continue iterating and upgrading this product while expanding its series of product designs in the future [3]