Core Viewpoint - The semiconductor wafer fabrication capacity is expected to grow from 31.5 million wafers per month in 2024 to 33.7 million wafers per month in 2025, driven by increasing chip demand, particularly from the AI and automotive electronics sectors [1][4] Group 1: Wafer Foundry Overview - Wafer foundry refers to the manufacturing of semiconductor wafers on behalf of integrated circuit design companies without engaging in design itself, playing a crucial role in the semiconductor industry [1] - The wafer foundry industry consists of upstream semiconductor materials, equipment, and design services, midstream wafer processing services, and downstream packaging/testing services, as well as end-use applications in consumer electronics, semiconductors, photovoltaic cells, and industrial electronics [1] Group 2: Manufacturing Processes - Wafer manufacturing processes can be categorized into advanced logic processes and specialty processes, with advanced processes defined as those below 14nm and mature processes as those 28nm and above [2] - The investment required for equipment significantly increases with process node evolution, with specialty processes requiring around $2-3 billion for every 50,000 wafers of capacity, while advanced processes require at least $4 billion [2] Group 3: Industry Advantages and Challenges - The wafer foundry industry currently benefits from a clear trend towards domestic production and sustained market demand [3] - Challenges include geopolitical instability, significant first-mover advantages for leading companies, reliance on key materials, and yield issues [3] Group 4: Market Status - The semiconductor industry is currently in a favorable economic cycle, with global semiconductor sales expected to grow at a compound annual growth rate (CAGR) of 9% from 2025 to 2030, surpassing $1 trillion by 2030 [4] - TSMC dominates the wafer foundry market with a 60% market share, while China is expected to lead in mature processes by 2027, with Taiwan maintaining dominance in advanced processes [4] Group 5: Key Domestic Players - Major domestic players include SMIC, Changhong Semiconductor, Jingxin Integrated Circuit, and Chipone Integrated Circuit, with SMIC being a leading global integrated circuit wafer foundry [5] - Huahong Semiconductor is recognized for its comprehensive specialty process platform, while Jingxin Integrated Circuit leads in the LCD panel driver chip foundry market [5] - Chipone Integrated Circuit focuses on power devices, MEMS, BCD, and MCU technology platforms, with AI being a new growth area [5] Group 6: Technology Development Trends - Global capacity is expanding, with market share concentrating among leading firms, and advanced processes like 3/2nm dominating the high-end market [6] - The collaboration between packaging and process technology is evolving, with 2nm processes expected to utilize GAAFET architecture, driven by increasing HPC demand due to AI advancements [6]
东兴证券:全球晶圆代工产能持续扩张 市场份额向头部企业集中