恒坤新材科创板IPO通过上市委会议 打破12英寸集成电路关键材料国外垄断

Core Viewpoint - Xiamen Hengkang New Materials Technology Co., Ltd. is seeking to raise 1.007 billion RMB through an IPO on the Shanghai Stock Exchange's Sci-Tech Innovation Board, focusing on the research and industrial application of key materials for integrated circuits [1] Company Overview - The company specializes in the research, production, and sales of key materials for integrated circuits, including photolithography materials and precursor materials, and is one of the few domestic firms capable of developing and mass-producing 12-inch integrated circuit wafer manufacturing materials [1][2] - Main products include SOC, BARC, KrF photolithography resin, i-Line photolithography resin, and TEOS precursor materials, with ArF immersion photolithography resin having passed validation and being sold on a small scale [1][2] Market Position - The domestic market for 12-inch integrated circuit photolithography and precursor materials is primarily dominated by foreign manufacturers, but the company has achieved significant breakthroughs and is now one of the main suppliers in China [2] - The company has successfully replaced products from major foreign competitors such as Dai Nippon, Shin-Etsu Chemical, DuPont, Merck, and others, covering major domestic 12-inch integrated circuit wafer manufacturers [2] Financial Performance - The company reported revenues of approximately 322 million RMB, 368 million RMB, and 548 million RMB for the years 2022, 2023, and 2024, respectively [2] - Net profits for the same years were approximately 99.73 million RMB, 89.76 million RMB, and 96.91 million RMB [2] - Total assets increased from 1.632 billion RMB in 2022 to 2.645 billion RMB in 2024, with equity attributable to shareholders rising from 1.273 billion RMB to 1.500 billion RMB over the same period [3]