Zheng Quan Zhi Xing·2025-08-29 17:01Core Viewpoint - The company is extending the construction period of its fundraising project "300mm High-end Silicon Material R&D Pilot Project" to December 2026 due to delays in project implementation while maintaining the original investment direction and total amount [7][8]. Fundraising Overview - The company raised a total of RMB 4,999,999,851.17 in 2022, with a net amount of RMB 4,946,185,486.46 after deducting issuance costs [1]. - The funds are managed in a dedicated account with a tripartite supervision agreement signed with the sponsor and the supervising bank [2]. Investment Project Details - The main use of the raised funds includes the "300mm High-end Silicon Wafer R&D and Advanced Manufacturing Project" and "300mm High-end Silicon Material R&D Pilot Project" [2]. - The total investment for the "300mm High-end Silicon Material R&D Pilot Project" is RMB 214,420.80 million, with RMB 200,000 million planned from the raised funds [3]. Delay Reasons - The project has faced delays due to extended procurement cycles for key equipment, complex technology development, strict customer validation processes, and a slowdown in the semiconductor market [4][5]. Project Necessity and Feasibility - The project remains necessary and feasible as it addresses the growing demand for SOI wafers in various applications, including automotive electronics and mobile terminals [5][6]. - The company aims to fill the domestic gap in 300mm SOI wafer production, enhancing self-sufficiency in critical semiconductor materials [5]. Market Environment - The semiconductor market is recovering, driven by demand in sectors like smartphones, IoT, and AI, providing a favorable environment for the project's implementation [6]. Conclusion on Project Extension - The extension of the project timeline is a prudent decision based on actual implementation conditions and does not adversely affect the company's operations or shareholder interests [7][8].