联创电子: 关于2025年度第一期科技创新债券发行结果的公告

Core Points - The company successfully issued its first phase of technology innovation bonds for the year 2025, with the funds raised on August 29, 2025 [2] - The total amount registered for the short-term financing bond is capped at 500 million RMB, with a two-year validity period for issuance [1] - The bond has a maturity of 182 days, with an interest rate of 2.8% and a face value issuance price of 100.00 [2] Summary by Sections - Bond Issuance Details - The company completed the issuance of its first phase of technology innovation bonds on August 29, 2025, with the funds successfully received on the same day [2] - The bond is identified as SCP001, with a maturity date set for February 27, 2026 [2] - Financial Information - The planned issuance amount was 50 million RMB, and the actual issuance amount was also 50 million RMB [2] - The bond's interest rate is set at 2.8% [2] - Use of Proceeds - The funds raised from this bond issuance will be used to repay existing borrowings [2] - Regulatory Compliance - The company is not listed as a subject of credit default as verified through the "Credit China" website [2]