联创电子科技股份有限公司关于2025年度第一期科技创新债券发行结果的公告

Core Viewpoint - The company has successfully registered and issued a short-term financing bond to raise funds for debt repayment, indicating a proactive approach to managing its financial obligations [1][2]. Group 1: Bond Issuance - The company plans to issue a total of up to 500 million RMB in short-term financing bonds, which was approved by the board and shareholders [1]. - The registration for the short-term financing bond was accepted by the trading association, with a validity period of two years for the registered amount [2]. - The first phase of the technology innovation bond for 2025 was completed on August 29, 2025, with the funds successfully received on the same day [2]. Group 2: Fund Utilization - The funds raised from the bond issuance will be used specifically for repaying existing loans, reflecting the company's strategy to manage its debt effectively [2]. Group 3: Compliance and Verification - The company has confirmed that it is not listed as a dishonest entity as per the verification conducted through the "Credit China" website [2].