智通财经网·2025-09-03 03:03Group 1 - The surge in equipment computing power demand is driving the need for effective heat dissipation solutions, with traditional passive cooling methods like graphene and VC expected to transition towards active cooling solutions [1] - The micro-pump liquid cooling solution is gaining traction, with a clear trend and strong implementation certainty, particularly in the context of AI innovations led by companies like Apple [2] - The liquid cooling driving chip technology presents a significant barrier, with limited competition from foreign analog manufacturers, creating a favorable competitive landscape for domestic companies [3] Group 2 - Aiwey Electronics has launched a new domestic liquid cooling driver, the AW86320 piezoelectric driver, capable of providing over 180Vpp, significantly enhancing cooling efficiency in small electronic devices [3] - Nanchip Technology has developed the SC3601 piezoelectric micro-pump liquid cooling driver chip, achieving a tenfold improvement in energy efficiency and low standby power consumption, filling a gap in domestic technology [3] - The micro-pump liquid cooling trend is expected to expand from mobile phone cases to high-end smartphones by Q4 2025, with 2026 anticipated to be a breakout year for active cooling solutions [2]