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打破国外长期垄断!江苏相城高新区“双高协同”创新破局
Yang Zi Wan Bao Wang·2025-09-03 08:23

Core Viewpoint - The collaboration between Honghu (Suzhou) Semiconductor Technology Co., Ltd. and Hohai University Suzhou Institute of Advanced Research has successfully developed a "vacuum environment ultra-clean wafer transfer robotic arm," breaking the long-standing foreign monopoly in the semiconductor industry [1][3]. Group 1: Industry Context - The vacuum environment ultra-clean wafer transfer robotic arm has been monopolized by companies like Japan's Lattice and America's Brooks, and is included in the export control list, posing a significant challenge to China's industrial chain security [3]. - Historically, domestic equipment has struggled with the issue of "assembling foreign core components," making self-sufficiency a pressing need [3]. Group 2: Technological Breakthroughs - The research team led by Professor Xu Linsen from Hohai University has focused on the technical challenges of ultra-clean wafer transfer in vacuum environments, utilizing integrated drive and magnetic fluid sealing technology to solve vacuum cleanliness control issues [5]. - The team has developed a real-time control system based on a domestic operating system, achieving nanosecond-level response precision and maintaining a repeat positioning accuracy of ±0.05mm, with horizontal vibration reduced to 0.2g, meeting international advanced standards [6]. Group 3: Collaborative Model and Impact - The partnership model of "high-tech zone providing the platform, enterprises posing the challenges, and universities solving the problems" has led to the creation of a domestically produced vacuum wafer transfer platform, filling a gap in domestic vacuum coating process transfer equipment [6]. - The developed equipment has been adopted by several industry benchmark companies, generating cumulative sales revenue of approximately 13 million yuan, with small-scale production steadily advancing [6]. - The team has also led the formulation of the "Vacuum Wafer Handling Robot Acceptance Specification" group standard and has secured six national invention patents, establishing a solid technological barrier [6].