中国芯片制造技术与西方存20年差距，光刻设备成关键瓶颈

Core Insights - A recent report from a well-known international investment institution indicates that China has a technological gap of approximately 20 years in advanced chip manufacturing compared to Western developed countries [1] - The report highlights a significant disparity in photolithography equipment manufacturing between China and the United States, identifying it as a major obstacle to producing high-end chips in China [1] Industry Summary - The most advanced photolithography equipment is developed and manufactured by European companies, which rely on core components from the United States, thus being affected by export controls [1] - Due to external restrictions, Chinese companies face difficulties in obtaining high-end photolithography equipment, directly impacting their research and mass production capabilities in advanced processes [1] - For instance, domestic major chip manufacturers are forced to use relatively outdated technologies to produce 7-nanometer chips, which not only affects production efficiency but also significantly increases manufacturing costs [1] Technology and Supply Chain - The manufacturing of high-end photolithography equipment involves a global supply chain, with key components primarily located in the US and Europe, indicating a substantial gap in China's self-sufficiency in this area [1] - Photolithography is a core technology that transfers chip design patterns onto silicon wafers, and high-end equipment enables finer line delineation, thereby enhancing overall chip performance [1] - After the pattern transfer, multiple processes such as etching, deposition, and cleaning are required to complete chip manufacturing, underscoring the irreplaceable role of photolithography equipment in the chip manufacturing process and its influence on the industry's advancement towards high-end development [1]