Jing Ji Ri Bao·2025-09-03 23:10Core Insights - TSMC is aggressively advancing in silicon photonics technology, surpassing Intel in the number of related patent applications in the U.S. [1][2] - Silicon photonics is essential for NVIDIA's next-generation AI servers, with TSMC positioning itself to capitalize on this growing market opportunity [1][2] - TSMC plans to complete validation of its compact universal photonic engine (COUPE) by 2025 and integrate it into CoWoS packaging by 2026, aiming to enhance AI transformation through improved connectivity [2] Patent Applications - TSMC applied for 50 silicon photonics-related patents in the U.S. in 2024, nearly double Intel's 26 applications [2] - In 2023, TSMC and Intel were nearly equal in patent applications, with TSMC at 46 and Intel at 43 [2] - TSMC has overtaken Intel in practical application, with plans for mass production of the latest CPO technology by 2026, while Intel remains in the research and validation phase [2] Collaboration and Technology Development - TSMC is deepening collaboration with ASIC and high-speed network chip manufacturer Marvell, focusing on processes below 3nm and next-generation silicon photonics technology [2] - TSMC has established a robust optical communication database to support its market expansion efforts [2] - TSMC's subsidiary, Caiming, is expected to integrate silicon photonics and CPO technologies, potentially becoming a significant growth driver for future operations [2][3] Technical Advancements - Caiming possesses wafer-level optical film processing capabilities, enhancing alignment and optical efficiency for light coupling at both receiving and transmitting ends [3] - The use of metalens technology is anticipated to improve light transmission coupling efficiency for customers [3]