清华大学突破EUV光刻胶技术，中国光刻机研发获重大进展

Core Insights - Tsinghua University has made significant advancements in EUV photoresist technology, which is crucial for China's lithography machine development [1] - The CEO of ASML, Christopher de Lattre, acknowledged that a defect in metal photoresist, which has been a challenge for ASML, has been addressed by a Chinese team [1] - China's lithography technology is evolving from "single-point breakthroughs" to "system integration," establishing an initial domestic industrial chain in mature processes, although challenges remain in high-end efficiency and core component bottlenecks [1] Industry Developments - The recent progress in EUV photoresist materials by Tsinghua University is a pivotal step in enhancing China's semiconductor capabilities [1] - The advancements are reshaping the global chip competition landscape, indicating a shift towards greater technological autonomy in the semiconductor industry [1] - Continuous breakthroughs in technology are essential for China to compete effectively in the high-end semiconductor market [1]