中微公司发布六大半导体设备新产品

Core Insights - Company announced the launch of six new semiconductor equipment products at CSEAC2025, covering critical processes such as plasma etching, atomic layer deposition (ALD), and epitaxy (EPI) [1] - R&D investment reached 1.492 billion yuan in the first half of 2025, a year-on-year increase of approximately 53.70%, representing about 30.07% of the company's revenue, significantly higher than the average R&D investment level of 10% to 15% for companies listed on the Sci-Tech Innovation Board [1] - The company has over 20 new equipment projects under development, with a significant reduction in development cycle time from 3-5 years to as short as 2 years [1] Product Highlights - Two new etching products were launched, including the CCP capacitive high-energy plasma etching machine Primo UD-RIE, designed for high aspect ratio etching, and the Primo Menova 12-inch ICP single-chamber etching equipment, focused on metal etching applications [2] - The Preforma Uniflash metal gate series in atomic layer deposition includes three products, catering to advanced logic and memory device applications [3] - The PRIMIO Epita RP, the world's first dual-chamber low-pressure epitaxy equipment, features a unique design that reduces production costs and chemical consumption while maintaining high production efficiency [3] Market Position - As a leader in high-end semiconductor equipment manufacturing in China, the company's plasma etching equipment is utilized by top international clients across various advanced integrated circuit production lines, covering 95% of domestic etching application needs [4] - The company has delivered over 6,800 plasma etching and chemical film equipment reaction chambers, achieving mass production and large-scale repeat sales across 155 production lines domestically and internationally [4]