中微半导体设备（上海）股份有限公司关于自愿披露公司发布新产品的公告

Core Viewpoint - The company has launched six new semiconductor equipment products, enhancing its capabilities in plasma etching, atomic layer deposition, and epitaxy, which will support its transformation into a high-end equipment platform company [2][5]. Group 1: New Product Overview - The company introduced two new etching devices focused on high aspect ratio etching and metal etching, providing advanced solutions for customers [2]. - The Primo UD-RIE? device features a dynamic edge impedance adjustment system and a multi-zone temperature control system, improving etching precision and production efficiency [3]. - The Primo Menova? 12-inch ICP etching device excels in metal etching, suitable for power semiconductors and advanced logic chips, with outstanding performance in etching uniformity and reduced contamination [3][4]. Group 2: Thin Film Deposition Equipment - The company launched four new thin film deposition products, including three atomic layer deposition products and one epitaxy product [4]. - The PreformaUniflash? metal gate series includes three products designed for advanced logic and storage devices, featuring a dual-reactor design for high vacuum system integration and leading production efficiency [4]. - The PRIMIO Epita? RP epitaxy device, with a unique dual-chamber design, offers high production efficiency while reducing costs and chemical consumption, suitable for various epitaxy process requirements [5]. Group 3: Impact on the Company - The introduction of these six new semiconductor equipment products is expected to meet increasing customer demands and expand the company's product portfolio, positively impacting future market expansion and performance growth in the semiconductor equipment sector [5].