Group 1 - The 2025 Third Data Center & AI Liquid Cooling Industry Chain Innovation Summit was held in Suzhou, attracting industry elites, experts, and corporate representatives to discuss advancements and application prospects in liquid cooling and high-power heat dissipation technology [1] - Dongguan Yidong Electronics Co., Ltd. showcased its innovative achievements and technical strength in the liquid cooling field, with products such as AI computing chip liquid cooling structural components and liquid cooling plate assemblies, which meet the stringent cooling demands of data centers and AI [1] - Yidong Electronics received the Cloud Sail Cup for outstanding contributions in liquid cooling core components, recognizing its excellence in the development and manufacturing of key components like cold plates, manifolds, quick connectors, CDU, sensors, pumps, and heat exchangers [1] Group 2 - Yidong Electronics has a strong technical foundation and rich industry experience in electronic manufacturing, and has recognized the significant potential in the liquid cooling market, increasing R&D investment and strategic layout in this area [2] - The company has expanded its business from IGBT cooling plates to AI computing chip liquid cooling structural components, achieving mass shipments and enhancing its market presence [2] - With the explosive growth in AI and efficient computing demands, the global cooling market is entering an unprecedented rapid growth phase, and Yidong Electronics aims to leverage its recent award as a new starting point to enhance R&D investment and product quality [2]
奕东电子荣获云帆杯液冷核心部件卓越贡献奖