Core Viewpoint - Southchip Semiconductor Technology (Shanghai) Co., Ltd. plans to issue convertible bonds to unspecified investors, with a total fundraising amount not exceeding RMB 193,338.11 million, aimed at financing specific projects in the semiconductor industry [1][16]. Group 1: Issuance Overview - The type of securities to be issued is convertible bonds that can be converted into the company's A-shares [2]. - The proposed issuance quantity is up to 19,333,811 bonds [2]. - The bonds will be issued at a face value of RMB 100.00 each [2]. - The duration of the bonds will be six years from the date of issuance [2]. - The interest rate will be determined by the company's board of directors based on market conditions and company specifics [2][4]. Group 2: Fund Utilization - The total investment for the projects funded by the issuance will be RMB 193,338.11 million, which will be allocated entirely to the development and industrialization of power management chips and sensor control chips [16]. - The company may initially use its own or self-raised funds for project implementation before the raised funds are available [16]. Group 3: Financial Information - As of June 30, 2025, the company's current assets amount to approximately RMB 4,116.81 million, with cash and cash equivalents at RMB 2,624.72 million [18]. - The total assets of the company are approximately RMB 4,900.36 million [18]. - The company has shown a steady increase in current assets from RMB 2,199.31 million in 2022 to RMB 4,116.81 million in 2025 [18].
南芯科技: 南芯科技向不特定对象发行可转换公司债券预案