Core Viewpoint - Shanghai Nanchip Semiconductor Technology Co., Ltd. plans to issue convertible bonds to unspecified investors, with a total fundraising amount not exceeding RMB 193,338.11 million, aimed at financing projects in the field of intelligent power management chips and industrial application sensors [13][19]. Board Meeting Details - The second board meeting of the company was held on September 5, 2025, with all 9 directors present, and the meeting was conducted in accordance with relevant laws and regulations [1][2]. Approval of Convertible Bonds - The board approved the proposal for the company to issue convertible bonds, confirming that the company meets the necessary conditions for such issuance under Chinese law [2][3]. - The proposed issuance includes up to 19,333,811 convertible bonds, each with a face value of RMB 100.00 [2][3]. Fundraising and Use of Proceeds - The total amount to be raised from the issuance of convertible bonds is capped at RMB 193,338.11 million, which will be allocated to specific projects in the semiconductor sector [3][13]. - The company will utilize its own or self-raised funds for project implementation before the proceeds from the bond issuance are available [13]. Bond Terms and Conditions - The bonds will have a maturity period of six years and will pay interest annually [4][5]. - The initial conversion price will be determined based on the average trading price of the company's A-shares over the 20 trading days prior to the announcement [5][6]. - The company has the right to adjust the conversion price under certain conditions, such as stock dividends or capital increases [6][7]. Rights and Obligations of Bondholders - Bondholders will have the right to convert their bonds into shares and participate in profit distributions on an equal basis with existing shareholders [11][12]. - The company will not provide guarantees for the bonds, and a credit rating agency will be engaged to assess the bonds [15][22]. Shareholder Meeting - A temporary shareholder meeting is scheduled for September 26, 2025, to review the bond issuance and related matters [24].
南芯科技: 第二届董事会第九次会议决议公告