Core Viewpoint - Shanghai Nanchip Semiconductor Technology Co., Ltd. plans to issue convertible bonds to unspecified investors, with a total fundraising amount not exceeding RMB 193,338.11 million, aimed at financing projects in the field of intelligent power management chips and industrial application sensors [2][14][15]. Meeting Details - The second supervisory board's ninth meeting was held on September 5, 2025, with all three supervisors present, confirming the legality and validity of the meeting [1][2]. Resolutions Passed - The supervisory board approved the proposal for the company to issue convertible bonds, confirming compliance with relevant laws and regulations [2][17]. - The proposal for the issuance of convertible bonds was passed, with a maximum issuance of 19,333,811 bonds, each with a face value of RMB 100.00 [2][3]. - The bonds will have a duration of six years, with interest paid annually [3][4]. Fund Utilization - The raised funds will be allocated to the development and industrialization of intelligent power management chips and industrial application sensors, with the total amount earmarked for these projects being RMB 193,338.11 million [14][15]. Rights and Obligations of Bondholders - Bondholders will have the right to convert their bonds into shares and participate in profit distribution on par with existing shareholders [12][13]. - The company will not provide guarantees for the convertible bonds [16]. Conditions for Redemption and Sale - The company has outlined conditions under which it may redeem the bonds or allow bondholders to sell them back, including scenarios where the stock price remains below certain thresholds [9][10][11]. Future Planning - The company has proposed a three-year shareholder return plan for 2025-2027 to enhance transparency in profit distribution and cash dividends [22].
南芯科技: 第二届监事会第九次会议决议公告