多点布局高成长赛道 温州宏丰研发金属基复合材料已切入热管理供应链

Group 1 - The company has achieved mass production of self-developed specialized thermal materials, specifically metal matrix composites, which are crucial for electronic packaging due to their excellent thermal properties, high thermal conductivity, and low expansion [1] - The demand for related materials is expected to grow rapidly due to the increasing infrastructure needs driven by AI computing power, particularly in the optical module industry [1] - The company has established a diversified product system that includes electrical contact materials, integrated electrical contact components, hard alloy materials, lithium battery copper foil, and other businesses, positioning itself as a leading manufacturer in the domestic market [1] Group 2 - The company's electrical contact materials and functional composite materials are widely used across various sectors, including aerospace, medical materials, 5G, liquid cooling technology, industrial electrical appliances, consumer electronics, household appliances, automotive engineering, automation equipment, wind and solar power generation, and data centers [2] - The self-developed specialized thermal materials are now in mass production and are extensively applied in consumer electronics and 5G smart terminal devices [2] - The company emphasizes material science and has established collaborations with global electrical equipment manufacturers like Schneider and Siemens to enhance product development and quality standards, thereby strengthening customer loyalty and brand influence [2] Group 3 - The company's subsidiary, Zhejiang Hongfeng Semiconductor New Materials Co., Ltd., focuses on the research, development, manufacturing, and sales of etching lead frame materials, which are essential for integrated circuit chip packaging [3] - Lead frames serve as the core carrier for integrated circuit chips, playing a critical role in connecting internal and external circuits during the chip packaging process [3] - The company is actively advancing product certification and market development, aiming to contribute to the domestic chip industry in the future [3]