Core Viewpoint - Nanchin Technology (688484.SH) plans to issue convertible bonds to raise funds for various chip development projects, with a total fundraising amount not exceeding 193.34 million yuan [1][2]. Group 1: Convertible Bond Issuance - The company intends to issue up to 19,333,811 convertible bonds, each with a face value of 100.00 yuan, with a maturity period of six years [1]. - The initial conversion price will be determined based on the average trading price of the company's A-shares over the previous twenty trading days and the last trading day, without upward adjustments [2]. - The funds raised will be allocated to three main projects: power management chips for intelligent computing, automotive chips, and industrial application sensors and control chips [2][3]. Group 2: Financial Performance - For the first half of 2025, the company reported a revenue of 1.47 billion yuan, representing a year-on-year increase of 17.60% [5][6]. - The net profit attributable to shareholders decreased by 40.21% to 123 million yuan, while the net profit after excluding non-recurring items fell by 52.70% to approximately 97 million yuan [5][6]. - The net cash flow from operating activities significantly declined by 98.24%, amounting to approximately 471 thousand yuan [5][6]. Group 3: Previous Fundraising and Use of Proceeds - In its previous public offering, the company raised a total of 254.06 million yuan, with a net amount of 237.48 million yuan after deducting issuance costs, exceeding the initial plan by 71.68 million yuan [4]. - The funds from the previous offering were intended for various chip development projects and working capital [4].
南芯科技拟发不超19.33亿可转债 2023上市即顶募25亿