联得半导体将携多款核心设备亮相深圳国际半导体展览会
SHENZHEN INT'LSHENZHEN INT'L(HK:00152) Xin Lang Cai Jing·2025-09-08 03:41

Group 1 - The SEMI-e Shenzhen International Semiconductor Exhibition and the 2025 Integrated Circuit Industry Innovation Exhibition will take place from September 10 to 12, 2025, at the Shenzhen International Convention and Exhibition Center [1] - The wholly-owned subsidiary, LianDe Semiconductor, will showcase several core equipment including soft solder die bonding machines, high-speed eutectic die bonding machines, and lead frame film lamination machines [1]