智通财经网·2025-09-08 07:52Core Viewpoint - Nvidia plans to adopt silicon carbide (SiC) substrates as intermediary materials in the advanced packaging of its next-generation GPU chips, which is expected to enhance heat dissipation performance and optimize overall packaging size [1][4]. Group 1: Silicon Carbide Applications - Silicon carbide materials have high application potential in advanced packaging, particularly in high-performance computing chips, which could open up new growth opportunities in the industry [2]. - The thermal conductivity of silicon carbide can reach 500 W/mK, significantly higher than silicon's thermal conductivity of approximately 150 W/mK, making it suitable for environments with high heat dissipation requirements [4]. Group 2: GPU Power and Packaging Requirements - The power of Nvidia's GPU chips has increased from 700W for the H200 to 1400W for the B300, leading to higher heat dissipation requirements in chip packaging [3]. - Current packaging technology, CoWoS, relies on traditional thermal interface materials, indicating room for optimization in heat dissipation methods [3]. Group 3: Investment Recommendations - Companies that could benefit from the application of silicon carbide in intermediary layers and heat dissipation substrates include Tianyue Advanced (02631) and Sanan Optoelectronics (600703.SH) [5].