Core Viewpoint - Kulicke and Soffa Industries, Inc. has launched ACELON™, a next-generation precision dispensing solution aimed at semiconductor, SMT, and automotive assembly applications, leveraging its established machine architecture in wire bonding [1][4]. Group 1: Product Features - ACELON™ addresses advanced dispense challenges with enhanced process stability, suitable for critical production environments [2]. - The system features a significantly expanded working area, allowing for flexibility in handling larger substrates and complex assembly configurations [2]. - It offers industry-leading precision with sub-20µm wet accuracy, ensuring consistent material placement for applications with strict dimensional tolerances [2][3]. Group 2: Technological Advancements - Key advancements include automatic calibration functions that streamline setup and reduce operator intervention [8]. - An optional Twin Valve/Dual Valve capability enhances throughput and configuration flexibility in high-volume production settings [8]. - AI-powered Auto Parameter Tuning (APT) optimizes system parameters based on process results and historical data, improving quality and throughput [8]. Group 3: Market Positioning - The company emphasizes that ACELON™ combines the reliability of its wire bonding architecture with ultra-precision dispensing capabilities and AI-driven optimization, setting a new benchmark for performance and reliability [4]. - ACELON™ will debut at the SEMICON Taiwan Trade Show from September 10 to September 12, 2025, with general availability expected by March 2026 [5].
Kulicke & Soffa Unveils ACELON™ - A Revolutionary High-Performance Dispenser for Advanced Manufacturing Applications