Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking

Joins an Industry-Leading Suite of Advanced Packaging SolutionsLeveraging the company's 15 years of leadership in advanced packaging and decades of expertise in dielectric films, TEOS 3D builds on Lam's existing VECTOR Core and TEOS product families, representing continuous innovation in materials and processes for integrated packaging. It is part of a comprehensive product portfolio of industry-leading solutions that addresses critical challenges and drives innovation and productivity across the advanced p ...