科翔股份：在通孔板领域，公司具备42层高精密通孔板的生产能力

Core Viewpoint - The company has the capability to produce high-precision through-hole boards with up to 42 layers and is committed to continuous R&D to enhance manufacturing capabilities [2]. Group 1 - The company is engaged in the production of multi-layer printed circuit boards (PCBs) [2]. - The company has confirmed its ability to manufacture 42-layer high-precision through-hole boards [2]. - The company plans to invest further in research and development to improve its manufacturing capabilities [2].