琻捷电子，拟赴港上市

Core Insights - The company, Panjie Electronics Technology (Jiangsu) Co., Ltd., has submitted its prospectus to the Hong Kong Stock Exchange, focusing on the research, design, and sales of high-performance automotive chips [1] Financial Performance - The company has reported consecutive net losses for the years 2022 to 2025, with net profits of approximately -205 million, -356 million, -351 million, and -143 million yuan respectively [2] - Revenue figures for the same period are approximately 104 million, 223 million, 348 million, and 157 million yuan respectively [2] Market Position - In 2024, the global market size for wireless automotive sensor SoCs is projected to reach 2.9 billion yuan, with the top five suppliers holding a combined market share of 70.4% [2] - Panjie Electronics is expected to generate approximately 209 million yuan in revenue from wireless automotive sensor SoCs in 2024, ranking third in the global market with a market share of 7.3% [2] Market Growth - The global market for wireless TPMS SoCs is anticipated to grow from 1.3 billion yuan in 2019 to 2.7 billion yuan in 2024, reflecting a compound annual growth rate (CAGR) of 15.9% [2] - The market for automotive wireless TPMS SoCs is projected to increase from 3.2 billion yuan in 2025 to 7.2 billion yuan by 2030, with a CAGR of 17.5% [2] Use of Proceeds - The funds raised will be utilized to expand the company's business scale, accelerate new product commercialization, procure wafers, and enhance internal module manufacturing capabilities [3] - Additional funds will be allocated to improve research and development capabilities in advanced technologies for smart tire sensor SoCs, BMS SoCs, and USI SoCs [3] Customer and Supplier Dynamics - The company's customer base primarily consists of direct sales clients, including tier-one suppliers and distributors, with revenue from the top five customers accounting for 41.2%, 35.6%, 52.1%, and 46.8% of total revenue from 2022 to 2025 [4] - The company relies heavily on a few suppliers for services such as wafer foundry and chip packaging/testing, with purchases from the top five suppliers representing 72.8%, 52.6%, 64.5%, and 63.9% of total procurement during the same period [4]