奇安信(688561.SH)：拟申请注册发行银行间债券市场非金融企业债务融资工具

Core Viewpoint - The company, Qi Anxin, plans to issue a total of up to 2 billion RMB in technology innovation bonds through the interbank bond market [1] Group 1 - The third meeting of the company's third board of directors will be held on September 12, 2025, to review the proposal for bond issuance [1] - The board has approved the application for registration to issue non-financial corporate debt financing instruments [1]