Core Viewpoint - The recent announcement by Dongcai Technology highlights the increased market attention on its high-speed electronic resin products, driven by the rising demand in the high-end server industry due to advancements in artificial intelligence and computing power upgrades [1] Group 1: Company Performance - Dongcai Technology's high-speed electronic resins, including bismaleimide resin, reactive ester resin, hydrocarbon resin, and polyphenylene ether resin, have shown significant competitive advantages and successful market expansion [1] - The company has established supply relationships with leading copper-clad laminate manufacturers, providing products to major server systems such as Nvidia, Huawei, Apple, and Intel, which has become a new growth point for its performance [1] Group 2: Industry Trends - Electronic resin is a key material in PCB manufacturing, accounting for 20%-30% of copper-clad laminate costs and 8%-12% of overall PCB costs, with technological iterations directly driving PCB performance upgrades [1] - The explosive demand for AI servers, 5G communication, and new energy vehicles is increasing the penetration rate of high-frequency and high-speed PCBs, leading to a gradual replacement of traditional epoxy resins with new types such as PPO, hydrocarbon resin (PCH), and PTFE [1] - New resins are becoming core materials for AI computing hardware upgrades due to their low dielectric loss (Df≤0.005) and high thermal stability, indicating a broad space for domestic substitution [1]
东材科技:高速电子树脂已供应到英伟达等主流服务器体系