聚鼎芯材完成A轮融资

Company Highlights - Nanjing Juding Chip Material Technology Co., Ltd. successfully completed its Series A financing, with exclusive strategic investment from Changxin Investment [1] - The company focuses on the research and production of bottom filling materials for integrated circuit packaging, which are crucial for semiconductor IC packaging, LED, smartphones, and automotive electronics [1] - The core products of Juding include conductive and insulating adhesives, which significantly impact the mechanical stability, thermal conductivity, and signal transmission quality of packaging structures [1] Industry Insights - The global semiconductor packaging materials market exceeded $20 billion in 2023, indicating substantial growth potential for domestic high-end bottom filling materials [1] - In 2023, over 10 domestic packaging material companies received financing, covering various sub-sectors such as photoresists, bonding wires, and molding compounds, showcasing the emergence of industry cluster effects [2] - The Pukou Economic Development Zone has become a key driver for the autonomous and controllable development of the integrated circuit industry chain, supported by comprehensive facilities, targeted policy support, and efficient service systems [2]