新型材料工艺刻蚀高性能微芯片

Core Insights - An international collaborative team has achieved a significant breakthrough in microchip manufacturing by developing a new type of material and process that enables the production of smaller, faster, and lower-cost high-performance chips [1][2] - The research combines experimental and modeling techniques, laying the foundation for next-generation chip manufacturing [1] Group 1: Research and Development - The team includes institutions such as Johns Hopkins University, Brookhaven National Laboratory, Lawrence Berkeley National Laboratory, East China University of Science and Technology, Soochow University, and École Polytechnique Fédérale de Lausanne [1] - The focus of the research is on using metal-organic materials as new types of photoresists, which can effectively respond to high-power "beyond extreme ultraviolet" (B-EUV) radiation [1] Group 2: Technological Advancements - The newly developed "chemical liquid deposition" process allows for large-area deposition of imidazole-based metal-organic photoresists on silicon wafers with nanometer-level precision in controlling coating thickness [2] - The method enables flexible adjustment of material response efficiency to specific wavelengths of radiation by varying the combination of metal types and organic molecules [2] Group 3: Future Implications - The research indicates that at least 10 metals and hundreds of organic compounds can be utilized to construct these material systems, providing ample room for future optimization [2] - The team believes that this technology has the potential to be industrially applied within the next decade [2]