Core Viewpoint - The company plans to issue convertible bonds to raise up to 1 billion yuan for acquiring a controlling stake in Ligon Technology and to supplement working capital [1] Group 1: Financing and Acquisition - The total amount of funds raised from the convertible bond issuance will not exceed 1 billion yuan, which will be used for the acquisition of Ligon Technology and to enhance liquidity [1] - The company intends to acquire a total of 88.79% equity in Guangzhou Ligon Technology Co., Ltd. through its wholly-owned subsidiary, Changying Holdings (Nanjing) Co., Ltd. [1] - The acquisition price is set at 709 million yuan, with an adjustment cap of 133 million yuan [1] - The funding for the acquisition will come from the company's own funds and external financing, with 700 million yuan from the convertible bond issuance earmarked for the acquisition payment [1] Group 2: Business Synergy and Market Position - Ligon Technology primarily distributes MCU chips, driver chips, and storage chips, representing well-known brands such as NXP, ISSI, and others [2] - NXP is a core product line for Ligon Technology, which has been a key distributor of NXP's products since its establishment [2] - The acquisition will enhance the company's product distribution portfolio and improve competitiveness by integrating Ligon Technology's authorized distribution capabilities with its existing business [2] - The company aims to meet customer demands for one-stop procurement, reduce overall procurement costs, and strengthen collaboration with manufacturers and clients, thereby enhancing market competitiveness and profitability [2]
为收购IC产品分销商立功科技控股权 商络电子(300975.SZ)拟发行不超10亿元可转债