润建股份：拟发行不超60亿元债务融资工具

Group 1 - The company plans to issue non-financial corporate debt financing instruments in the interbank bond market with a total amount not exceeding 60 billion yuan [1] - The proposal was approved by the company's board of directors on September 17, 2025, and will require approval from the shareholders' meeting and the China Interbank Market Dealers Association [1] - The types of instruments to be issued include short-term financing bonds and medium-term notes, each not exceeding 30 billion yuan [1] Group 2 - The raised funds will be used for investments in computing power and other infrastructure, as well as to repay the company's interest-bearing debts [1] - The objective of the fundraising is to optimize the company's debt structure and reduce financial costs [1]