华为公布未来三年昇腾芯片演进和目标：950PR明年Q1推出
Di Yi Cai Jing·2025-09-18 02:36
Group 1 - Huawei's rotating chairman Xu Zhijun announced the evolution and goals of the Ascend chip series at the Huawei Connect Conference on September 18 [1] - Over the next three years, Huawei has planned multiple Ascend chips, including the 950PR, 950DT, and Ascend 960 and 970 [1] - The 950PR chip is set to be launched in the first quarter of 2026 and will utilize Huawei's self-developed HBM technology [1]