打造全球最强算力 华为徐直军时隔六年再谈芯片进展

Core Viewpoint - Huawei has made significant advancements in self-developed chips and AI infrastructure, showcasing its commitment to enhancing computing power for artificial intelligence applications in the coming years [1][3][5]. Group 1: Chip Development - Huawei plans to release multiple Ascend chips, including the 950PR, 950DT, and Ascend 960 and 970, with the 950PR set to launch in Q1 2026 featuring Huawei's self-developed HBM technology [1]. - The company has emphasized the importance of computing power as a key driver for artificial intelligence, particularly in the context of China's AI development [3]. Group 2: AI Infrastructure - The deployment of over 300 Cloud Matrix 384 supernodes marks a new norm in AI infrastructure, with Huawei focusing on a "supernode + cluster" computing solution to meet the growing demand for computing power [3]. - Huawei introduced the Atlas950 SuperPoD and Atlas 960 SuperPoD supernodes, supporting 8192 and 15488 Ascend cards respectively, positioning them as global leaders in key performance metrics [5]. Group 3: Technological Innovations - The launch of the TaiShan 950 SuperPoD marks Huawei's entry into general computing supernodes, aiming to replace various large and small machines as well as Exadata database systems [5]. - Huawei has overcome significant challenges in interconnecting large-scale supernodes, introducing the UnifiedBus protocol, with plans to open up the Lingqu 2.0 technology specifications in the future [5]. Group 4: Competitive Positioning - Despite facing challenges due to U.S. sanctions and limitations in chip manufacturing capabilities, Huawei leverages its extensive experience in connectivity technology to maintain a competitive edge in supernode capabilities [6].