万通智控：Fellow 1芯片研发设计已基本完成 明年一季度可以流片

Core Insights - The company has established a special team stationed at Shenming Aosi to collaborate on product development and application expansion [1] Group 1 - The research and design of the Fellow 1 chip has been largely completed [1] - Sample delivery is expected to begin in October this year, with further optimizations based on testing results [1] - Mass production is anticipated in the first quarter of next year [1]