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新思科技总裁盖思新:三大技术突破正重塑芯片工程设计范式
Xin Hua Cai Jing·2025-09-19 08:19

Group 1 - The core viewpoint of the articles highlights that Synopsys is achieving technological breakthroughs in three key areas: system-level design, chip design upgrades, and AI agents, which are reshaping the paradigm of chip engineering design [2] - In system-level design, Synopsys integrates analog and chip design capabilities to provide lifecycle optimization solutions for intelligent systems across various domains such as electronics, electrical, thermal, and mechanical [2] - For chip technology upgrades, Synopsys leverages electronic design automation (EDA) solutions and intellectual property (IP) products, combined with multi-physical field analysis technology, to address complex issues like power consumption, heat dissipation, and electromagnetic compatibility in advanced processes [2] Group 2 - The development framework for intelligent systems is outlined, resembling the automotive industry's evolution from advanced driver-assistance systems (ADAS) to fully autonomous driving, depicting the progression from basic capabilities to advanced decision-making and action capabilities in autonomous multi-agent systems [3] - Synopsys collaborates with various industry players to develop differentiated intelligent systems, which will enhance rather than replace developers, helping R&D teams accelerate innovation and alleviate developer shortages [3] - The future of chip engineering design is emphasized to be in adopting a comprehensive, intelligent-driven approach from chips to systems, with Synopsys positioned at the forefront of this "redesign engineering" transformation [3] Group 3 - In July 2023, under the leadership of Sassine Ghazi, Synopsys successfully completed the acquisition of Ansys, marking a strategic transition from "chip" to "system" [3] - The company asserts that as complex intelligent systems like robots and autonomous vehicles become mainstream, single-domain technical solutions will no longer suffice, necessitating a seamless capability from chips to systems to create greater value for future technological development [3]