Industry Overview - Epoxy molding compound (EMC) is essential for semiconductor packaging, widely used in integrated circuits, semiconductor devices, and LED chips [1][4] - The Chinese epoxy molding compound market is projected to reach approximately 10.023 billion yuan in 2024, with a year-on-year growth of 9.93% [1][10] - Growth is driven by the booming electronic information industry, continuous expansion in the semiconductor and new energy sectors, and increasing demand for domestic alternatives [1][10] Market Size - The demand for high-performance epoxy molding compounds is significantly increasing due to the rise of emerging industries such as 5G communication, new energy vehicles, and smart manufacturing [1][10] - Advanced packaging technology development is raising performance requirements for epoxy molding compounds, including high thermal conductivity, low expansion coefficients, and high reliability [1][10] Industry Chain - The upstream of the epoxy molding compound industry includes raw materials such as epoxy resin, high-performance phenolic resin, spherical silica powder, curing agents, and additives [4] - The midstream involves the production and manufacturing of epoxy molding compounds, while the downstream directly applies these materials in semiconductor packaging testing across various sectors, including consumer electronics, automotive electronics, industrial control, photovoltaics, LEDs, power modules, and sensors [4] Key Companies - Jiangsu Huahai Chengke New Materials Co., Ltd. is a leading domestic player in the epoxy molding compound market, with a projected revenue of 332 million yuan in 2024, reflecting a year-on-year growth of 26.63% [10] - Tianjin Kaihua Insulation Materials Co., Ltd. focuses on epoxy powder encapsulation and epoxy molding compounds, with a revenue of 2.0594 million yuan in the first half of 2025, showing a year-on-year increase of 116.85% [10] Industry Development Trends 1. Continuous technological innovation will drive performance improvements in the epoxy molding compound industry, focusing on higher insulation, better heat resistance, and stronger chemical resistance [11] 2. Stricter environmental regulations will push the industry towards green production, with an emphasis on low-VOC and solvent-free epoxy molding compounds [12] 3. The demand for high-performance epoxy molding compounds will continue to grow, particularly in automotive electronics and new energy sectors, with expectations for significant contributions from applications like vehicle-mounted chips and IGBT modules [13]
研判2025!中国环氧塑封料行业产业链、市场规模及重点企业分析:半导体封装关键材料,性能迭代与需求扩张共驱发展[图]