国产算力产业链，迎来十年黄金期！

Core Insights - Huawei's announcement of the Ascend AI chip roadmap at the Full Connect Conference on September 18 marks a strategic declaration for the future of China's AI computing industry, transitioning from "catching up" to "running alongside" global competitors [2] - The introduction of the SuperNode technology, which allows for massive cluster support and high performance, signifies a shift in focus from single-card performance to system-level innovation [3][4] Group 1: Technological Innovations - The Atlas 950 SuperPoD supports a cluster of 8192 cards with a computing power of 8 EFlops and a total bandwidth of 16.3 PB/s, while the future Atlas 960 SuperPoD will support 15488 cards with 30 EFlops and 34 PB/s bandwidth [3] - Huawei's system-level innovations include a fully interconnected architecture, resource pooling and scheduling, and a liquid cooling revolution, which collectively enhance operational efficiency and reduce power consumption [4][6] Group 2: Addressing Industry Challenges - The Ascend 950PR chip, set to launch in Q1 2026, addresses the "memory wall" issue in large model training by supporting FP8 low precision format and featuring 128GB of memory [7] - The introduction of self-developed HBM (HiBL 1.0) marks a significant breakthrough in the storage chip sector, potentially alleviating the "memory wall" bottleneck in the future [7] Group 3: Market Implications - The roadmap for Ascend chips and the deployment of SuperNodes present a once-in-a-decade opportunity for the domestic computing industry, indicating a shift from mere "domestic substitution" to genuine technological breakthroughs [8] - The complete domestic computing chain is being formed, encompassing everything from chips to clusters and manufacturing to cooling solutions, reshaping the industry ecosystem [8]