Core Insights - Shanghai Zhanchip Electronics Technology Co., Ltd. has completed its Series C financing round, raising over 1 billion RMB, aimed at expanding its silicon carbide (SiC) production capacity and enhancing product development and market promotion [1] Group 1: Financing and Investment - The Series C financing was led by the National Development Bank's Manufacturing Transformation and Upgrade Fund, with participation from multiple investment institutions, bringing the total financing since its establishment in 2017 to nearly 3 billion RMB [1] - The funds will be used to accelerate domestic substitution of SiC devices and improve product performance and market competitiveness [1] Group 2: Product Development and Market Position - The company has successfully mass-produced three generations of SiC power device products, achieving industry-leading technical specifications and supplying to several well-known electric vehicle manufacturers and Tier 1 suppliers [2] - SiC power devices are recognized as a new generation of energy electronic devices with significant potential in various sectors, including electric vehicles, power grids, photovoltaics, and energy storage [2] Group 3: Industry Trends and Future Prospects - SiC is considered one of the hottest wide bandgap semiconductor materials, representing the core of the "third generation semiconductor" [2] - Recent reports indicate that NVIDIA plans to use 12-inch SiC substrates in the advanced packaging of its next-generation GPU chips to address heat dissipation issues and enhance performance, potentially by 2027 [3]
瞻芯电子完成逾10亿元C轮融资 用于产能扩张及产品研发
Zheng Quan Shi Bao Wang·2025-09-22 12:15