PDF Solutions Secures Landmark Contract with Global IDM Customer

Core Insights - PDF Solutions has signed a significant multi-year contract to expand its collaboration with a major global semiconductor manufacturer, deploying eProbe tools and associated analytics software across multiple high-volume manufacturing facilities [1][3][6] - The eProbe technology enables contactless testing of 3D semiconductor structures, optimized for specific wafer designs, and is supported by a comprehensive software suite for machine optimization and results analysis [2][4] - The contract validates PDF Solutions' strategic vision and highlights the importance of integrating process characterization data with design layout and in-line fabrication data to enhance yield diagnosis and variability control [5][6] Technology and Innovation - The eProbe technology is designed for advanced node development and high-volume manufacturing, facilitating faster yield learning in manufacturing environments [3][4] - The integration of eProbe DirectScan™ with Characterization Vehicle test chips and Exensio analytics software allows for improved detectability and root cause analysis at parts per billion (ppb) levels [5][6] Strategic Vision - PDF Solutions aims to create a cross-industry analytics and collaboration platform that connects key players in the semiconductor ecosystem, enhancing the value of secure connected solutions [6][7] - The company emphasizes the necessity of comprehensive connectivity for achieving faster yield ramps and successfully implementing AI solutions across the semiconductor supply chain [7] Financial Outlook - PDF Solutions reaffirms its revenue growth guidance for the full year 2025, projecting an increase of 21% to 23% compared to 2024 [8]