四方达：目前公司已具备批量制备大尺寸金刚石衬底及薄膜的相关生产能力

Core Viewpoint - The company has developed the capability for mass production of large-size diamond substrates and films, which can be utilized in chip heat sinks due to their high thermal conductivity [1] Group 1 - The company confirmed its ability to produce large-size (inch-level) diamond substrates and films [1] - Diamond's high thermal conductivity makes it suitable for applications in chip heat sinks and other related fields [1] - The company will continue to monitor market opportunities related to this technology [1]